3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, (Hardcover)

Name: 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, (Hardcover)
Brand: Lennart Bamberg
SKU: prod_1dd18b5b7668454d7a78c0d1
Price: 209.00 USD
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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, (Hardcover) Author: Springer ISBN: 9783030982287 Format: Hardcover Publication Date: 2022-06-28 Page Count: 395

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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, (Hardcover)—

$209.00

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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, (Hardcover)—

$209.00