5700M Series A10-5750M AM5750DEC44HL — Quad-Core 2.5GHz (3.5GHz Turbo) Socket FS1, 4M Cache, Radeon HD 8650G

Model/ID: A10-5750M (CPU part number AM5750DEC44HL) — OEM/tray microprocessor from the 5700M series. Processor stepping/brand details: Richland (stepping RL-A1), CPUID 610F31. Microarchitecture: Piledriver on the Comal platform. Manufacturing process: 0.032 microns. Data width: 64 bits. Clocking and cores: Base frequency 2500 MHz with a maximum turbo frequency of 3500 MHz. Quad-core design with 4 threads. Floating-point units are integrated and shared between the two cores in each module. Cache: L1 — 2 x 64 KB 2-way set-associative shared instruction cache and 4 x 16 KB 4-way set-associative data cache. L2 — 2 x 2 MB 16-way set-associative shared exclusive cache. No L3 cache. Cache latency: 3 (L1 cache). Multiprocessing: uniprocessor. Package & socket: Packaged in a 722-Pin Organic Capless Micro Lead Grid Array (UOL722). Socket: FS1 (FS1r2). Physical dimensions: 1.38" x 1.38" / 3.5cm x 3.5cm. Weight: 0.2oz / 6g. Integrated graphics: Radeon HD 8650G with 384 shader cores. GPU core frequency: 533 MHz (fundamental) up to 720 MHz (maximum). Memory & controllers: Single memory controller with 2 memory channels. Supported memory types: DDR3-1866, DDR3L-1600, DDR3U-1333. Maximum memory bandwidth: 29.9 GB/s. Peripherals & I/O: PCI Express 2.0 support. Unified Video Codec 3.2. Instruction set extensions and features: MMX / MMX extensions; SSE, SSE2, SSE3, SSSE3; SSE4 (SSE4.1 + SSE4.2), SSE4a; AES; AVX; BMI1; F16C; FMA3; FMA4; TBM; XOP; AMD64 (64-bit); -V virtualization technology; EVP (enhanced virus protection). Turbo 3.0 technology supported. Power management & states: Low power features include C1, C1E, C6 and CC6 states. System sleep states: S3, S4 and S5. "Power up now!" Electrical / thermal: Thermal Design Power (TDP): 35 W. Maximum operating temperature: 105°C.