E3-1220LV2 / E3 1220L V2 2.3 GHz Dual-Core CPU 17W LGA1155

Overview: Intel Xeon E3-1220L v2 (E3-1220LV2 / E3 1220L V2) low-power server processor. Dual cores with 4 threads, base clock 2.3 GHz, and a Thermal Design Power of 17 Watt. Socket: 1155 / H2 / LGA1155 (1155-land Flip-Chip Land Grid Array). Identification & platform: S-spec CM8063701099001. Microarchitecture: Ivy Bridge on the Carlow (Ivy Bridge-H2) platform. Stepping L1 (SR0R6), CPUID 306A9 (SR0R6). Introduction date: 14-May-12. Last order date: January 23, 2015. Last tray shipment: January 8, 2016. Last boxed shipment: July 10, 2015. Physical & packaging: Package type FCLGA 1155. Die size: 1.48" x 1.48" / 3.75cm x 3.75cm. Manufacturing process: 0.022 micron High-K metal gate process. Data width: 64 bit. Performance & caches: Clock multiplier: 23. CPU cores: 2. Threads: 4. Floating Point Unit: Integrated. L1 caches: 2 x 32 KB instruction (8-way) and 2 x 32 KB data (8-way). L2 caches: 2 x 256 KB (8-way). L3 cache: 3 MB shared. Memory & I/O: Maximum physical memory: 32 GB. Memory controller: 1. Memory channels: 2. Supported memory types: DDR3-1333, DDR3-1600. Maximum memory bandwidth: 25.6 GB/s. ECC supported: Yes. Other interfaces: Direct Media Interface 2.0 and PCI Express 3.0. Extensions & technologies: MMX; SSE; SSE2; SSE3; SSSE3; SSE4 (SSE4.1 + SSE4.2); AES; AVX; F16C; EM64T; NX / XD (Execute disable bit); VT-x (virtualization); VT-d (virtualization for directed I/O); TBT 2.0; Turbo Boost technology 2.0; TXT; HT (Hyper-Threading); SMEP (Secure Mode Execution Protection). Low-power feature: Enhanced SpeedStep technology. Multiprocessing: Uniprocessor. Graphics & thermal: Integrated graphics: None. Thermal Design Power: 17 Watt. Security & management: Includes vPro technology and Identity Protection technology. Condition: 95% New (slight scratches on the surface).