IEEE Press: 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility (Hardcover)

Name: IEEE Press: 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility (Hardcover)
Brand: Lih-Tyng Hwang; Tzyy-Sheng Jason Horng
SKU: prod_a79d57945224f03d76a8a8f4
Price: 367.00 USD
Availability: InStock

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IEEE Press: 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility (Hardcover)—

$367.00

Price unavailable

IEEE Press: 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility (Hardcover)—

$367.00