IEEE Press Advances in Embedded and Fan-Out Wafer Level Packaging Technologies, (Hardcover)

Name: IEEE Press Advances in Embedded and Fan-Out Wafer Level Packaging Technologies, (Hardcover)
Brand: Beth Keser
SKU: prod_eb351c9f36041714dbd0efb1
Price: 283.00 USD
Availability: InStock

IEEE Press Advances in Embedded and Fan-Out Wafer Level Packaging Technologies, (Hardcover) Author: Wiley-IEEE Press ISBN: 9781119314134 Format: Hardcover Publication Date: 2019-02-12 Page Count: 576

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IEEE Press Advances in Embedded and Fan-Out Wafer Level Packaging Technologies, (Hardcover)—

$283.00

Price unavailable

IEEE Press Advances in Embedded and Fan-Out Wafer Level Packaging Technologies, (Hardcover)—

$283.00