IFIP Advances in Information and Communi Micro-Assembly Technologies and Applications: Ifip Tc5 Wg5.5 Fourth International Precision Assembly Seminar (Ipas'2008), Book 260, (Hardcover)

IFIP Advances in Information and Communi Micro-Assembly Technologies and Applications: Ifip Tc5 Wg5.5 Fourth International Precision Assembly Seminar (Ipas', Book 260, (Hardcover) Author: Springer ISBN: 9780387774022 Format: Hardcover Publication Date: 2008-01-15 Page Count: 416

Shipping & Returns

Product image 1
Price unavailable
IFIP Advances in Information and Communi Micro-Assembly Technologies and Applications: Ifip Tc5 Wg5.5 Fourth International Precision Assembly Seminar (Ipas'2008), Book 260, (Hardcover)
$146.00