Intel Xeon E5-2670 v2 2.5GHz — 10-core / 20-thread LGA2011 CPU, 25MB L3, 115W (Ivy Bridge-EP)

Overview: Server-class Xeon E5-2670 v2 (Fits Xeon E5-2600 v2 family) — 10 cores, 20 threads, built on the Ivy Bridge-EP microarchitecture. Base frequency 2500 MHz with multi-core Turbo Boost up to 3300 MHz depending on active cores. Frequencies and bus: Base clock 2500 MHz. Max Turbo Frequency: 2900 MHz (5 cores or more); 3000 MHz (4 cores); 3100 MHz (3 cores); 3200 MHz (2 cores); 3300 MHz (1 core). QPI interconnect: 8 GT/s (4000 MHz) and also supports 5 GT/s. Clock multiplier: 25. Package and dimensions: LGA2011 (Socket 2011) 2011-land Flip-Chip Land Grid Array. Physical size: 2.07" x 1.77" / 5.25 cm x 4.5 cm. Part numbers and steppings: OEM/tray part number CM8063501375000. Boxed part number BX80635E52670V2. S-spec / stepping identifiers include QEN3, QF6V, SR1A7. CPUID 306E4 (SR1A7). Platform: Romley-EP / Romley-WS. Stepping: M0 (QEN3) and M1 (QF6V, SR1A7). Manufacturing and architecture: Ivy Bridge-EP microarchitecture, manufacturing process 0.022 microns. Data width: 64 bits. Floating point unit: fused. Caches: L1 — 10 x 32 KB instruction, 10 x 32 KB data (each 8-way set-associative). L2 — 10 x 256 KB (8-way set-associative). L3 — 25 MB shared, 20-way set-associative. Memory and multiprocessing: Single memory controller (Number of Controllers: 1) with 4 memory channels. Supports DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600, DDR3-1866. Up to 3 DIMMs per channel. Maximum supported physical memory: 768 GB (per slot). Maximum memory bandwidth: 59.7 GB/s. ECC supported. Multiprocessing: up to 2 processors. Instructions and technologies: Supports MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, F16C, EM64T, NX/XD (Execute Disable Bit), Hyper-Threading (HT), VT-x, VT-d, Turbo Boost Technology 2.0 (TBT 2.0), TXT (Trusted Execution Technology), and Enhanced Intel SpeedStep Technology. I/O and integrated features: No integrated graphics. Integrated memory controller. Direct Media Interface 2.0. Fast path interconnect (2 links). PCI Express 3.0 interface. Electrical and thermal: Operating voltage range 0.65V - 1.3V. Operating temperature range 5°C - 82°C. Thermal Design Power (TDP): 115 watts.