Springer Advanced Microelectronics 3D Microelectronic Packaging: From Architectures to Applications, Book 64, (Hardcover)

Name: Springer Advanced Microelectronics 3D Microelectronic Packaging: From Architectures to Applications, Book 64, (Hardcover)
Brand: Yan Li
SKU: prod_a1ff48f2d6da90e080dd6f99
Price: 294.00 USD
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Springer Advanced Microelectronics 3D Microelectronic Packaging: From Architectures to Applications, Book 64, (Hardcover) Author: Springer ISBN: 9789811570896 Format: Hardcover Publication Date: 2020-11-24 Page Count: 622

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Springer Advanced Microelectronics 3D Microelectronic Packaging: From Architectures to Applications, Book 64, (Hardcover)—

$294.00

Price unavailable

Springer Advanced Microelectronics 3D Microelectronic Packaging: From Architectures to Applications, Book 64, (Hardcover)—

$294.00