Woodhead Publishing Electronic and Optic Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, (Paperback)

Name: Woodhead Publishing Electronic and Optic Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, (Paperback)
Brand: Hengyun Zhang
SKU: prod_48e183155059e11d205b0729
Price: 335.00 USD
Availability: InStock

Woodhead Publishing Electronic and Optic Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, (Paperback) Author: Woodhead Publishing ISBN: 9780081025321 Format: Paperback Publication Date: 2019-11-15 Page Count: 434

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Woodhead Publishing Electronic and Optic Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, (Paperback)—

$335.00

Price unavailable

Woodhead Publishing Electronic and Optic Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, (Paperback)—

$335.00